Match your solder paste manufacturers' precise specifications for preheat, soak, reflow, and cooling with the MC301N Nitrogen Batch Reflow Oven. By simulating the conditions of an inline reflow system in a benchtop unit, the MC301N is ideal for product development, prototyping, and manufacturability testing. Detailed solder profiles are easily programmed, stored, and downloaded through the MC301N's exclusive hardware control app and Android operating system. Android architecture also allows users to take advantage of touch screen operation and integrated wireless networking for data transfer. Connection for nitrogen input and integrated flow controller included. Specifications: Applicable Solder Types Lead-Free or SnPb Heating Method IR & Forced Hot Air Convection User Interface Android Software Platform Ultra High Resolution Touchscreen Integrated WiFi & Networking Effective Soldering Area 9.84" x 7.87" (250 mm x 200 mm) Temperature Range Ambient - 310 °C Temperature Precision ±2 °C Temperature Control Method PID Control; SSR Contactless Switch Circuit Warm-Up Time Approx. 2.5 min. Power 3.6 KW (avg.); 6.3 KW (max.) Voltage 220 V, Single Phase, 50/60 Hz Nitrogen Input Pressure 0.6MPa (87 psi) Maximum Flow Rate 120 to 150 l/min N2 Gas Flow Software Programmable Oxygen Level 3000 ppm with 5 l/min Exhaust Temperature (approx.) 60°C