Outstanding Features:

• Wide Temperature range: 0° to +200°C
• DC Control System minimizes electrical noise
• Temperature Stability :±0.1°C
• Temperature Accuracy: ±0.5°C calibrated against transfer standard
• Advanced ThermoChuck Design:
  • Low stray capacitance and high electrical resistance to ground: Surface Electrical Isolation: >109 ohms at 500 VDC between surface and ground at +25°C ; higher isolation configurations are available
  • Superior chuck temperature uniformity: ±0.5°C or ±0.5% of set temperature
  • Guarded ( low leakage) chuck configurations are optional

Standard Features:

• IEEE-488 or RS232 remote interface
• Proven high reliability
• ThermoChuck interfaces to most major standard and automatic wafer probing stations, laser trimmers and inspection stations
• No Liquid Nitrogen or CO2 is required for cooling.
• HCFC-free and CFC-free
• Certified  Compliant  

Applications:

• Thermal cycling and steady- state thermal testing of wafers, hybrids and other flat devices from 0°C to +200°C
• Moisture-free cold testing of wafers to 0°C with Controlled Environment Enclosure
• Low noise test applications
• High isolation and guarded ( low leakage) applications
• Thermal characterization of standard and high power devices