The small footprint and convenience of the TP4500A System make this system ideal for use in all laboratories or production facilities for testing, characterization and failure analysis of devices and PCBs to commercial/industrial specifications.
For temperature cycling with fast transitions and high airflow at all temperatures, the TP4500A provides the necessary environment to quickly thermally test devices of any size and power dissipation from small NAND Flash to larger high power devices and PCBs.